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Surface Mount Adhesive

► Surface Mount Adhesive

 

GB981100

　▐　Specialty

 

This product is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It has great thixotropy & variable dynamic viscosity which is suitable for high-speed SMT dispensing.

 

     - Curing Temperature from 150°C - 220°C
     - Non-slumping & High Wet Strength
     - High Temperature Resistant
 

 

　▐　Application Industry

 

Industrial Computers
Appliance Control Panel
Automotive Control Panel
Military Board Instruments
Navigation Control Panel
Automatics Control Panel
LED Control Panel
Inverter Circuit Board
 

 

　▐　Typical Property

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GB981100

Liquid

Property

Appearance

Red viscous gel

Viscosity

400,000~600,000 mPa·s

Density (g/cm3)

1.25  g/cm3

Thixotropy Index

T.I. = 2.7

Cure Condition

120°C ≒ 100 sec

150°C ≒ 60 sec

Storage Condition

Viscosity Vary Range < 10 % (3 days / 25°C)

Cured

Property

Glass Transition Temperature

110°C

DMA

Maximum Heat Resistance

280°C

DMA

Shearing Strength

19 MPa

ASTM D1002

Hardness

85 D

ASTM D2240

Surface Resistivity (Ω)

2 x 1015

ASTM D257

Bonding Strength

Ceramic Capacitors (2012)

44N

Ceramic Capacitors (1608)

12N

 

 

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